Mr. SHEIKH
In a strategic move signaling potential collaboration with industry giant NVIDIA, Samsung has reportedly placed significant orders for 2.5D packaging equipment. The South Korean tech giant is gearing up to play a crucial role in NVIDIA’s supply chain, particularly for the production of the next-generation AI GPUs, including the much-anticipated “Blackwell” set to debut in 2024.
As NVIDIA aims to capture a staggering $300 billion from the AI segment by 2027, diversifying its supply chain becomes imperative. Samsung’s acquisition of 16 units of packaging equipment from Japanese firm Shinkawa positions the company as a key player in supporting Team Green’s ambitions. The deal also leaves room for additional units, indicating Samsung’s preparedness to scale up production based on the demand it observes from clients.
The Elec reports highlight that NVIDIA plans to leverage Samsung’s HBM3 and 2.5D packaging capabilities for the production of AI GPUs. This strategic allocation aims to ease the burden on existing vendors like TSMC, enabling NVIDIA to meet the soaring demands in the data center segment efficiently.
Samsung’s foray into the AI sector gained momentum with the announcement of its SAINT tech, which rivals TSMC’s CoWoS packaging solution. With orders secured from AMD and Tesla, Samsung is poised to emerge as a key player in the AI market. This move not only promises economic upturns in Samsung’s memory and AVP divisions but also solidifies its position as a sought-after partner in the semiconductor, packaging, and memory processes.
The tech giant’s proactive approach to securing orders aligns with the growing demand for its services. As the Samsung NVIDIA collaboration navigates this surge in demand, it holds the potential to reshape the AI market, establishing itself as a pivotal player in the evolving landscape.
Source: The Elec
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