Oliver
Samsung has launched the thinnest LPDDR5X DRAM chip, marking a significant advancement in mobile memory technology. This 12 nm class chip is available in 12 GB and 16 GB packages, primarily targeting smartphones equipped with on-device AI capabilities.
The new LPDDR5X DRAM chip measures just 0.65 mm in thickness, making it 9% thinner than its predecessor. This innovation significantly enhances cooling efficiency by an estimated 21.2%. Samsung achieved this breakthrough by optimizing printed circuit board (PCB) and epoxy molding compound techniques, resulting in a chip size comparable to a fingernail.
Built in a 4-stack structure, the chip consists of four layers, each containing two LPDDR DRAMs. Samsung has already begun shipping this advanced chip to manufacturers, addressing the growing demand for high-performance, high-density mobile memory solutions. Future developments include 6-layer 24 GB and 8-layer 32 GB modules in similarly thin packages, catering to the evolving needs of mobile devices.
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